What are the advantages of ceramic substrate

The thermal expansion coefficient of ceramic substrate is close to that of silicon chip, which can save the transition layer Mo sheet, save labor, save material and reduce cost;

◆ Reduce welding layer, reduce thermal resistance, reduce hole, improve yield;

◆ Under the same load flow, 0.3mm thick copper foil wire width is only 10% of the ordinary printed circuit board;

◆ Excellent thermal conductivity, so that the chip packaging is very compact, so that the power density is greatly improved, improve the reliability of the system and device;

◆ Ultra-thin ceramic substrate (0.25mm) can replace BeO, no environmental toxicity problem;

◆ Large flow, 100A current through 1mm wide 0.3mm thick copper body, temperature rise of about 17℃; 100A current continuously passes through the copper body 2mm wide 0.3mm thick, and the temperature rise is only about 5℃;

Low thermal resistance, 10×10mm ceramic substrate thermal resistance 0.63mm thickness ceramic substrate thermal resistance of 0.31K/W, 0.38mm thickness ceramic substrate thermal resistance of 0.19K/W, 0.25mm thickness ceramic substrate thermal resistance of 0.14K/W.

◆ High insulation voltage, to ensure personal safety and equipment protection ability.

◆ New packaging and assembly methods can be realized, so that the product is highly integrated and the volume is reduced.